Thermal Interface Matarial

RTV

- Usability to various shapes as a liquid form
- The role of transferring heat from the heating element to the heat sink located between the heating element and the heat sink
- Various applications of heat dissipation for electrics and its component which emit heat

  • Thermal conductivity of
    1.0~5.0 W/mk

  • High electrical properties
    (Withstand voltage and volumetric resistance)

  • 1-Liquid type
    convenient to use

  • Oil breathing and
    Low molecular weight siloxane reduction

  • Room temperature and
    water hardened product

  • Flame retardant
    (UL94-V0)

P/N METHOD 1.0 W 2.0 W 2.0 W 1.0 W
Type Normal Low Specific Gravity
Specific Gravity ASTM D792 2.25 ± 0.1 2.65 ± 0.1 2.65 ± 0.1 2.25 ± 0.1
Viscosity (Pa.s) Paste Paste Paste Paste
Curing Time (Min) 7 day 23℃, 50%RH 7 day 23℃, 50%RH 7 day 23℃, 50%RH 7 day 23℃, 50%RH
Tack Free Time (Min) 10 10 10 10
Pot Life (Min) - - - -
Hardness ASTM D2240 Costomer Oder
Thermal Conductivity (W/mK) ISO 22007 1.0 2.0 1.0 1.0
Flammability UL94 V-0 TEST V-0 V-0 V-0 V-0
Diectric Strength (KV/mm) ASTM D149 More Than 10 More Than 10 More Than 10 More Than 10
Volume Resistivity (Ω·cm) ASTM D257 More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
Continue Use Temp. (℃) -40 ~ +200 -40 ~ +200 -40 ~ +160 -40 ~ +160