Thermal Interface Matarial

Gap Filler

It is used when there is a far distance between the heat-generated position and the cooling surface,
various heights, large cumulative tolerance, and variable or irregular surface.

Before use

After use

  • Available to be used to
    various heat generation elements

  • Excellent heat conductivity
    with outstanding adhesion

  • Flexible rubber composition, protection from mechanical impact, stress, and heat acceptability.

P/N METHOD 1.0 W 2.0 W 3.0 W 5.0 W 1.0 W 2.0 W 3.0 W
Type - Normal Low Specific Gravity
Cure System Two - Component
Specific Gravity ASTM D792 2.25 ± 0.1 2.65 ± 0.1 2.95 ± 0.1 3.1 ± 0.1 1.65 ± 0.1 1.85 ± 0.1 2.0 ± 0.1
Viscosity (Pa.s) (Mixed) 8 ~ 10 12 ~ 15 30 ~ 40 120 ~ 140 10 ~ 30 30 ~ 50 80 ~ 100
Curing Time (Min) 25℃ * 24h 25℃ * 24h 25℃ * 24h 25℃ * 24h 25℃ * 24h 25℃ * 24h 25℃ * 24h
Tack Free Time - - - - - - -
Pot Life (Min) 240 240 240 240 240 240 240
Hardness (Shore A, OO) ASTM D2240 Costomer Oder
Thermal Conductivity (W/mK) ISO 22007 1.0 2.0 3.0 5.0 1.0 2.0 3.0
Flammability UL94 V-0 TEST V-0 V-0 V-0 V-0 V-0 V-0 V-0
Diectric Strength (KV/mm) ASTM D149 More Than 10 More Than 10 More Than 10 More Than 10 More Than 10 More Than 10 More Than 10
Volume Resistivity (Ω·cm) ASTM D257 More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
More Than
1.0 X 10¹²
Continue Use Temp. (℃) -40 ~ +200 -40 ~ +200 -40 ~ +200 -40 ~ +200 -40 ~ +160 -40 ~ +160 -40 ~ +160